With the development of society and the progress of industry, the demand for power devices in rail transportation, electronic power, aerospace and other fields is increasing day by day. Among them, key components such as wafers and ceramic substrates will continue to explode, and these key components often require extremely precise structural dimensions and extremely high flatness. Polishing, as the most critical link in the production process of such components, determines the overall quality of the product. good or bad. In the cost breakdown of wafer manufacturing materials, polishing materials account for 7% of the total wafer manufacturing cost. Polishing fluids, polishing pads, etc. are important consumables in the polishing process and are also key factors in polishing. Therefore, there is a high demand and strict requirements for abrasives such as CeO2, SiO2, Al2O3, SiC, c-BN, diamond, and various additives. requirements. In addition, with the rise of new-generation semiconductor industries such as sapphire, silicon carbide, gallium nitride, and diamond, higher-end grinding and polishing materials that meet the processing needs of hard and brittle materials have become a key research object in countries around the world. At present, high-end polishing materials are mainly monopolized by leading companies in the United States and Japan. Cabot of the United States, Hitachi and Fujimi of Japan account for more than half of the global market share of polishing fluids. In the global polishing pad market, Dow's market share is close to 80%. As an important auxiliary material, polishing materials have become a link that must be overcome for my country's semiconductor industry to achieve independent control of the entire industry chain. In this context, China Powder Network will hold the 2024 High-end Grinding and Polishing Materials Technology Conference in Zhengzhou, Henan on July 9. The conference will bring together domestic industry experts, scholars, technicians, and business representatives to focus on high-end grinding and polishing materials and technologies, Lectures and exchanges on grinding and polishing equipment and applications.