shenzhen-tgv-advanced-process-demonstration-production-line-exhibition-for-glass-substrates

  • 2026/10/27 ~ 2026/10/29

  • Upcoming

    Shenzhen World Exhibition & Convention Center (Bao’an New Venue)

  • SHENZHEN, GuangZhou, china

Exhibition/Conference Introduction

I. Exhibition Zone Positioning
The TGV industry is at a critical transition stage from pilot testing to mass production, with downstream end manufacturers actively sourcing supply chains — this presents a prime window to secure orders. At C-TOUCH & DISPLAY SHENZHEN 2026 (Halls 10, 12, 14, 16), Hall 16 features a full immersive demonstration production line dedicated to Through-Glass Via (TGV) substrates, co-hosting a special industry forum together with Xuns Optocom. On-site business matching sessions for overseas buyers will also be arranged.
Hosted in Shenzhen, the industrial heartland of the Pearl River Delta, the show gathers clients across the complete industrial chain. It focuses on high-growth sectors including AI computing power, CPO optical modules, Micro LED displays and advanced packaging, accelerating the industrialization of domestic TGV technologies.
II. Core Exhibition Highlights
Full-Scale Physical Demonstration Production Line
The line fully replicates six core TGV manufacturing procedures: raw glass substrate pretreatment → via drilling → metallization coating & filling → CMP planarization → RDL wiring → inspection & dicing. On-site technical specialists provide detailed process explanations to visualize mature mass-production solutions.
Centralized Exhibition of Full-Chain Enterprises
Exhibitors cover upstream and downstream players including glass substrate raw material suppliers, cleaning equipment manufacturers, PVD coating providers, precision processing foundries, packaging & testing houses, optical module makers, Micro LED chip suppliers and optical consumable vendors (examples: Zhengyang Cleaning, Arison Coating, Jingchuangpin Substrate Processing).
Concurrent Technical Forum
The forum titled Micro-LED + AI Computing Optical Interconnection & Advanced Packaging Technology for Glass Substrates features corporate technical presentations, panel discussions and one-on-one targeted buyer-supplier matchmaking, covering cutting-edge topics such as CPO, mass TGV manufacturing and optical interconnection.
III. Supporting Services & Promotion
Targeted Invitation of Professional Audiences
Exclusive invitations extended to R&D and procurement executives from BOE, TCL, Corning, Innolight, JCET, and enterprises specializing in packaging & testing, optical modules, Micro LED products and PCB substrates.
Omnichannel Exposure & Offline Business Development
Multi-million-scale email campaigns, industry community outreach and live coverage via vertical media platforms are deployed. Post-show factory tours to leading substrate, optical module and packaging manufacturers are organized for in-depth technical exchanges.
IV. Core Value
The exhibition connects the full TGV industrial chain from raw materials and process equipment to end applications. It showcases independent domestic technologies, facilitates industry-university-research commercialization, and creates a face-to-face business negotiation platform for equipment suppliers, material manufacturers and end-product brands.
V. Organizer Resources
The C-TOUCH & DISPLAY SHENZHEN brand has a 28-year legacy. We maintain long-term partnerships with industry leaders including BOE, HKC, W-OLED and Schott.
We served as a specially invited co-organizer (designated by Hubei Provincial Government) for Wuhan Optics Valley Expo 2026 in May, granting access to its buyer resources spanning optical modules, storage, AI computing power and CPO.
Eight flagship exhibitions run concurrently across nine halls during the event.
Reed Exhibitions, headquartered in the UK, ranks among the world’s leading exhibition groups.

Exhibition/Conference Details

Exhibition/Conference Name Official website
shenzhen-tgv-advanced-process-demonstration-production-line-exhibition-for-glass-substrates Click to visit
Date and time (expected) Scale (exhibitors/number of participants)
2026/10/27 ~ 2026/10/29
9:00 AM - 6:00 PM
3500
Host city Venue address
china GuangZhou SHENZHEN Shenzhen World Exhibition & Convention Center (Bao’an New Venue)
Organizer / undertaker / contractor
-
Host
-
Co-organiser
-

作为极具规模及影响力的光电产业综合性展会,,同期六展覆盖信息通信、激光、红外、紫外、精密光学、镜头及模组、传感等版块,面向光电及应用领域展示前沿的光电创新技术及综合解决方案,助力企业紧跟行业发展政策趋势、洞察行业市场信息、搭建产业链上下游联系。

地址

广东省深圳市宝安区福海街道展城路1号

已主办展会

10次
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