2021 22nd International Conference on Electronic Packaging Technology (ICEPT) will be held in Xiamen, China, from August 11 to 14, 2021. The ICEPT 2021 is hosted by Xiamen University and Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), organized by School of Electronic Science and Engineering of Xiamen University, Xiamen Semiconductor Investment Group Co., Ltd. and Beijing Faith Information Consultant Ltd. As one of the most famous international conferences on electronic packaging technology, the conference has received strong support from IEEE- EPS and high praise from Chinese Institute of Electronics (CIE) and China Association for Science and Technology (CAST). At present, Moore's Law has reached an inflection point, semiconductor manufacturing technology is facing challenges, and new packaging technologies are constantly emerging. This conference will provide an academic communication platform for new progresses and new ideas in electronic packaging and manufacturing technology for experts, scholars and researchers from academia and industry worldwide.

During the four-day event, participants from many countries and regions will share the latest technological developments of electronic packaging technologies via special lectures, invited talks, theme forums, technical sessions, exhibitions, poster presentations and other forms. We sincerely invite you to join in this event!